Ansys Electronics Software

Electronics Simulation Software

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About Ansys Electronics

Ansys electromagnetic field simulation helps you design innovative electrical and electronic products faster and more cost effectively. In the  world of high performance electronics and advanced electrification systems, the effects of electromagnetic fields on circuits and systems are critical. Ansys software uniquely simulates electromagnetic performance across component, circuit, and system design. It also evaluates temperature, vibration, and other critical mechanical effects.

This unmatched electromagnetic-centric design flow helps you achieve first-pass system design success for advanced communication systems, high-speed electronic devices, electromechanical components and power electronics systems.

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Electronics Software Categories

Ansys high-frequency electromagnetics design software enables you to design, simulate and validate the performance of antennas and RF and microwave components. The integrated microwave circuit and system modeling capabilities have direct integration to our EM solvers delivering a platform for full-system verification of next-generation RF and microwave designs.
The Ansys Chip-Package-System (CPS) design flow delivers unparalleled simulation capacity and speed for power integrity, signal integrity and EMI analysis of high-speed electronic devices. Automated thermal analysis and integrated structural analysis capabilities complete the industry’s most comprehensive chip-aware and system-aware simulation solution across the chip-package-board.
Ansys electromechanical and power electronics simulation software is ideal for applications which depend on the robust integration of motors, sensors, and actuators with electronics controls. Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise- vibration harshness (NVH).
Ansys electronics thermal management solutions leverage advanced solver technology with robust, automatic meshing to enable you to rapidly perform heat transfer and fluid flow simulation for convective and forced air cooling strategies. Our solutions help you design cooling strategies to avoid excessive temperatures that degrade the performance of IC packages, printed circuit boards (PCBs), data centers, power electronics and electric motors.

Electronics Simulation Applications

High-Frequency and RF Applications

These simulations focus on the behavior and performance of electromagnetic waves and radio frequencies in systems such as antennas, radar, and RF defense applications. They help optimize antenna placement, reduce interference, and improve the accuracy of RF-dependent technologies across industries like telecommunications, automotive, and defense.

Electromagnetic Compatibility and Power Systems

Ensuring signal quality and managing power flow are critical to the reliability of electronic devices and systems. These simulations address interference, compatibility, and power distribution issues, helping engineers enhance the performance and reliability of electronics, particularly in high-frequency and high-power applications.

Low-Frequency and Thermal Applications

Simulations in this category cover the performance and reliability of low-frequency electromagnetic systems, such as electric motors, and the critical aspect of thermal management in electronics. By optimizing cooling and ensuring long-term reliability, these tools are essential for improving the efficiency and lifespan of electrical systems.

Ansys Electronics Flagship Products

Ansys Electronics software solutions integrate with other software for optimum performance across multiple industries. Use products in automotive, aerospace, defense, medical, transportation, and energy applications.

A 3D EM field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.
An EM field solver for electric machines, transformers, actuators and other electromechanical devices. It solves static, frequency- domain, and time-varying electric fields.
A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.
A CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, power electronics
Premier software package for the engineer solving problems across the electronics design spectrum. All Ansys electronics technologies are included in this single user package
A 2D and 3D EM field simulator to extract RLCG parameters from an interconnect. It’s a parasitic extraction tool to design electronic packaging and power electronic devices.
Electronics Pro 2D is ideal for 2D low frequency electromagnetic analysis, 2D parameter extraction, RF system analysis for the prediction of radio frequency interference and circuit simulation with advanced RF functionality
Electronics design software that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages.
A template-based design tool for fast multiphysics analyses of electric motors across the full torque-speed operating range to optimize their performance, efficiency and size.
Platform-level electromagnetic cable modeling and simulation tool that delivers a design-to- validation workflow including (EMI)/ (EMC) certification support.

Electronics Simulation Learning Center

Check out our articles and tutorials on Ansys Electronics products!

What’s New in Ansys 2026 R1?
By Katie McCaslin
March 11, 2026

What’s New in Ansys 2026 R1? Ansys 2026 R1 introduces significant advancements in AI‑driven simulation, high‑performance computing, and multiphysics modeling. Engineers can now explore larger design spaces,…Read more

PCB Design and Layout Guide
By Katie McCaslin
February 24, 2026

A Guide to PCB Design and Layout
Printed circuit boards…Read more

RF Challenges in Chiplet-Based Architectures and Advanced Packaging
By Katie McCaslin
January 27, 2026

RF Challenges in Chiplet-Based Architectures and Advanced Packaging
Chiplet-based architectures have moved from…Read more

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